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  • Focused On
  • Temperature-Sensitive Components

Low Temperature Cure Adhesives

Our family of low temperature cure epoxy adhesives meets the increasing need for materials that are compatible with temperature-sensitive components. These products not only can be applied and cured at low temps, but also cure quickly in order to optimize line speeds, without compromising final adhesive strength. This is important for many applications, including camera module house bonding, large screen backlight, and some filter bonding applications.

H.B. Fuller's family of low temperature cure adhesives is designed to include:

  • Materials for all methods of dispensing
  • Adhesion to difficult substrates
  • Fast curing materials, suitable for high-speed production
  • A variety of viscosities for a wide range of processes and applications
  • High reliability & optimal end-use performance

Low Temperature Cure Adhesive Products

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Market: Electronic and Assembly Materials
Application: Low Temperature Cure Adhesives
Used For: Temperature-sensitive components
Technology: Epoxy
    Features and Benefits:
    • Designed for camera module assembly
    • Color: White
    • Viscosity at 25°C (cPs): 35,000
    • Cure Schedule: 20 minutes at 80°C 50 minutes at 70°C
    • Pot Life at 25°C: 14 days
    • Storage Temperature: -20°C

Low Temperature Cure Adhesives

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