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  • Focused On
  • Reworkability and Protection from Mechanical Impact

Underfill and Edge Bonding Materials

The reworkable underfill chip-scale package materials from H.B. Fuller are based on a one-component epoxy system. These products feature high-purity resin (low halogen content), fast cure at low temperatures, and easy reworkability. They provide superior protection from mechanical impact.

Capillary Underfill
H.B. Fuller’s portfolio of capillary underfill products features fast dispensing at room temperature in 0.4 mm pitch CSP. The process time demands of large-scale production require underfill materials that flow at room temperature without additional processes. For large-scale manufacturers of electronic portable devices, use of these products will facilitate equipment savings and reduce technology investment. Some materials are specially designed for compatibility with temperature sensitive components, such as camera modules, and cure quickly at 80°C.

  • Compatibility with a lead-free curing profile
  • Reworkability
  • Low temperature curing
  • High reliability
  • Rapid filling at room temperature for 0.4 mm pitch CSP or WLCSP, without substrate preheating
  • A variety of viscosity options for a range of application requirements, including lower gap heights and smaller pitch

Edge Bonding
In additional to capillary underfill materials, H.B. Fuller also offers a variety of edge bonding materials across a range of viscosities and cure profiles. These products provide excellent performance in applications such as corner reinforcement and narrow edge bonding.

Underfill and Edge Bonding Materials Products

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FH8050 CONTACT US
Market: Electronic and Assembly Materials
Application: Underfill and Edge Bonding Materials
Used For: Edge bonding applications without impact
Technology: Epoxy
    Features and Benefits:
    • Designed for edge bonding application without impact
    • Capability in corner reinforcement
    • Self-alignment in lead-free reflow
    • Good dispensing performance and shape retention
    • Capability in narrow edge CSP or WLCSP
    • Color: Black
    • Viscosity at 25°C: Thixo
    • Cure Schedule: Compatible with lead-free profile
    • Storage Temperature: -40°C

EA6037 CONTACT US
Market: Electronic and Assembly Materials
Application: Underfill and Edge Bonding Materials
Used For: Flexible electronics reinforcement
Technology: Acrylate
    Features and Benefits:
    • Flexible Designed for electronics reinforcement
    • Excellent adhesion on a wide range of materials
    • Color: Semi-trans-parent
    • Viscosity at 25°C: 20,000
    • Cure Schedule: UV 1000 mJ/cm²
    • Storage Temperature: 25°C

FH8708 CONTACT US
Market: Electronic and Assembly Materials
Application: Underfill and Edge Bonding Materials
Used For: Capability in SMA and corner reinforcement
Technology: Epoxy
    Features and Benefits:
    • High reliability
    • Very low CTE
    • Excellent adhesion to wide range of materials
    • Capability in SMA and corner reinforcement
    • Gives excellent adhesion on a wide range of materials
    • Color: Black
    • Viscosity at 25°C: 340,000
    • Cure Schedule: Heat curable
    • Storage Temperature: 2-8°C

Underfill and Edge Bonding Materials

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