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  • Focused On
  • Reworkability and Protection from Mechanical Impact

Underfill and Edge Bonding Materials

The reworkable underfill chip-scale package materials from H.B. Fuller are based on a one-component epoxy system. These products feature high-purity resin (low halogen content), fast cure at low temperatures, and easy reworkability. They provide superior protection from mechanical impact.

Capillary Underfill
H.B. Fuller’s portfolio of capillary underfill products features fast dispensing at room temperature in 0.4 mm pitch CSP. The process time demands of large-scale production require underfill materials that flow at room temperature without additional processes. For large-scale manufacturers of electronic portable devices, use of these products will facilitate equipment savings and reduce technology investment. Some materials are specially designed for compatibility with temperature sensitive components, such as camera modules, and cure quickly at 80°C.

  • Compatibility with a lead-free curing profile
  • Reworkability
  • Low temperature curing
  • High reliability
  • Rapid filling at room temperature for 0.4 mm pitch CSP or WLCSP, without substrate preheating
  • A variety of viscosity options for a range of application requirements, including lower gap heights and smaller pitch

Edge Bonding
In additional to capillary underfill materials, H.B. Fuller also offers a variety of edge bonding materials across a range of viscosities and cure profiles. These products provide excellent performance in applications such as corner reinforcement and narrow edge bonding.

Underfill and Edge Bonding Materials Products

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Display 1 - 10 out of All Products
FH8006 CONTACT US
Market: Electronic and Assembly Materials
Application: Underfill and Edge Bonding Materials
Used For: High reliability portable devices
Technology: Epoxy
    Features and Benefits:
    • Designed for high reliability portable devices
    • Fast flow performance in 25 micro gap at 25°C
    • Good for use in mass production
    • Color: Black
    • Viscosity at 25°C: 500
    • Cure Schedule: 10 minutes @ 120°C
    • Tg °C: 99
    • Pot Life: 3 days
    • Storage Temp: -20°C

FH8009 CONTACT US
Market: Electronic and Assembly Materials
Application: Underfill and Edge Bonding Materials
Used For: High reliability portable devices
Technology: Epoxy
    Features and Benefits:
    • Designed for high reliability portable devices
    • Reworkable
    • Fast flow performance in 25 micro gap at 25°C
    • Good for use in mass production
    • Color: Black
    • Viscosity at 25°C: 500
    • Cure Schedule: 8 minutes @ 130°C
    • Tg °C: 83
    • Pot Life: 3 days
    • Storage Temperature: -20°C

FH8010 CONTACT US
Market: Electronic and Assembly Materials
Application: Underfill and Edge Bonding Materials
Used For: Reworkabliity
Technology: Epoxy
    Features and Benefits:
    • Reworkable
    • Fast flow at room temperature
    • Color: Pale yellow
    • Viscosity at 25°C: 600
    • Cure Schedule: 5 minutes @ 100°C
    • Tg °C: 55
    • Pot Life: 7 days
    • Storage Temperature: 2 -8°C

FH8013 CONTACT US
Market: Electronic and Assembly Materials
Application: Underfill and Edge Bonding Materials
Used For: Reworkability
Technology: Epoxy
    Features and Benefits:
    • Reworkable
    • Substrate preheat is required
    • Color: Black
    • Viscosity at 25°C: 1,700
    • Cure Schedule: 10 minutes @ 150°C
    • Tg °C: 87
    • Pot Life: 4 days
    • Storage Temperature: 2-8°C

FH8014 CONTACT US
Market: Electronic and Assembly Materials
Application: Underfill and Edge Bonding Materials
Used For: Reworkability
Technology: Epoxy
    Features and Benefits:
    • Reworkable
    • Fast flow at room temperature
    • Substrate preheat is required
    • Color: Light yellow
    • Viscosity at 25°C: 1,600
    • Cure Schedule: 10 minutes @ 120°C
    • Tg °C: 60
    • Pot Life: 4 days
    • Storage Temperature:2-8°C

FH8016 CONTACT US
Market: Electronic and Assembly Materials
Application: Underfill and Edge Bonding Materials
Used For: Reworkability on high reliability devices
Technology: Epoxy
    Features and Benefits:
    • Designed for higher reliability
    • Reworkable
    • Fast flow performance (25um/25C)
    • Color: Black
    • Viscosity at 25°C: 700
    • Cure Schedule: 8 minutes @ 130°C
    • Tg °C: 126
    • Pot Life: 3 days
    • Storage Temperature: 2-8°C

Underfill and Edge Bonding Materials

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