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  • Focused On
  • Mobile Device Assembly

Reactive Hot Melt Adhesives

H.B. Fuller's family of reactive hot melt adhesives includes products that are specifically designed for mobile device assembly. Our products are designed to cover a broad spectrum of applications from touch panel assembly to mobile phone parts bonding, by providing a range of performance characteristics including impact, chemical, moisture, and temperature resistance.Some of these products have gasket-like properties, which provide outstanding sealing and protecting capability for electrical and electronic devices from moisture, water, oils, and contaminants such as dust.Other products are specially formulated for applications that require reworkability of an assembly. These materials combine high performance and reliability with mechanisms to remove the adhesive and reuse the components.

Our Family of reactive hot melt adhesives includes products that offer:

  • Robust, tough, single-component construction
  • Near instantaneous bond strength
  • Adhesion to a wide variety of substrates
  • Resistance to chemicals, fuels and oils
  • Reduced need for primers, as they are not typically required to develop good bond strength
  • Formation of a resilient, tough polymer after cure, but can also be flexible

Reactive Hot Melt Adhesive Products

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Display 1 - 10 out of All Products
EH9680 CONTACT US
Market: Electronic and Assembly Materials
Application: Reactive Hot Melt Adhesives
Used For: Chemical resistance
Technology: Hot Melt
    Features and Benefits:
    • Very good chemical resistance
    • Long working time
    • Color: Light Yellow
    • Viscosity at application temperature (cPs): 4,400 at 110°C
    • Working Time: 9 minutes
    • Cure Time: 2-4 days
    • Modulus (MPa): 48
    • OLSS, PC-PC (MPa): 8.4

EH9672 CONTACT US
Market: Electronic and Assembly Materials
Application: Reactive Hot Melt Adhesives
Used For: Chemical resistance
Technology: Hot Melt
    Features and Benefits:
    • High reliability and very good reworkability
    • Excellent adhesion to plastics
    • Color: Light Yellow
    • Viscosity at application temperature (cPs): 3,600 at 110°C
    • Working Time: 15 minutes
    • Cure Time: 1-2 days, Modulus (MPa): 28
    • OLSS, PC-PC (MPa): 8.3

EH9652 CONTACT US
Market: Electronic and Assembly Materials
Application: Reactive Hot Melt Adhesives
Used For: PET, ABS adhesion
Technology: Hot Melt
    Features and Benefits:
    • Excellent adhesion to PET and ABS
    • Color: Light White
    • Viscosity at application temperature (cPs): 5,800 at 110°C
    • Working Time: 4 minutes
    • Cure Time: 2-4 days
    • OLSS, PC-PC (MPa): 12.6

EH9671 CONTACT US
Market: Electronic and Assembly Materials
Application: Reactive Hot Melt Adhesives
Used For: Reworkability
Technology: Hot Melt
    Features and Benefits:
    •  High reliability and excellent reworkability
    • Excellent adhesion to metals
    • Fast cure
    • Color: Light Yellow
    • Viscosity at application temperature (cPs): 3,100 at 110°C
    • Working Time: 15 minutes
    • Cure Time: 1-2 days
    • Modulus (MPa): 26
    • OLSS, PC-PC (MPa): 7.6

EH9670 CONTACT US
Market: Electronic and Assembly Materials
Application: Reactive Hot Melt Adhesives
Used For: Reworkability
Technology: Hot Melt
    Features and Benefits:
    • Medium reworkability and reliability
    • Color: Light Yellow, White, or Black
    • Viscosity at application temperature (cPs): 3,700 at 110°C
    • Working Time: 4 minutes
    • Cure Time: 2-4 days
    • OLSS, PC-PC (MPa): 7.6

EH9650 CONTACT US
Market: Electronic and Assembly Materials
Application: Reactive Hot Melt Adhesives
Used For: Metal adhesion
Technology: Hot Melt
    Features and Benefits:
    • Excellent adhesion to metals
    • Capability in narrow edge bonding
    • Color: Light Yellow, White, or Black
    • Viscosity at application temperature (cPs): 3,700 at 110°C
    • Working Time: 4 minutes
    • Cure Time: 2-4 days
    • Modulus (MPa): 36
    • OLSS, PC-PC (MPa): 8.9

EH9641 CONTACT US
Market: Electronic and Assembly Materials
Application: Reactive Hot Melt Adhesives
Used For: Metal adhesion
Technology: Hot Melt
    Features and Benefits:
    • Good adhesion to metals
    • Capability in narrow edge bonding
    • Fast set time
    • Color: Light White, White, or Black
    • Viscosity at application temperature (cPs): 3,700 at 110°C
    • Working Time: 2.5 minutes
    • Cure Time: 1-2 days
    • Modulus (MPa): 35,
    • OLSS, PC-PC (MPa): 8.3

Reactive Hot Melt Adhesives

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