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  • Focused On
  • Temperature-Sensitive Components

Low Temperature Cure Adhesives

Our family of low temperature cure epoxy adhesives meets the increasing need for materials that are compatible with temperature-sensitive components. These products not only can be applied and cured at low temps, but also cure quickly in order to optimize line speeds, without compromising final adhesive strength. This is important for many applications, including camera module house bonding, large screen backlight, and some filter bonding applications.

H.B. Fuller's family of low temperature cure adhesives is designed to include:

  • Materials for all methods of dispensing
  • Adhesion to difficult substrates
  • Fast curing materials, suitable for high-speed production
  • A variety of viscosities for a wide range of processes and applications
  • High reliability & optimal end-use performance

Low Temperature Cure Adhesive Products

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Contact Us for ordering information on all our application solutions.
Display 1 - 10 out of All Products
FH8601 CONTACT US
Market: Electronic and Assembly Materials
Application: Low Temperature Cure Adhesives
Used For: Temperature-sensitive components
Technology: Epoxy
    Features and Benefits:
    • High viscosity
    • Low shrinkage
    • Color: Black
    • Viscosity at 25°C (cPs): 55,000
    • Cure Schedule: 20 minutes at 80°C 30 minutes at 70°C
    • Pot Life at 25°C: 14 days
    • Storage Temperature: -20°C

FH8602 CONTACT US
Market: Electronic and Assembly Materials
Application: Low Temperature Cure Adhesives
Used For: Temperature-sensitive components
Technology: Epoxy
    Features and Benefits:
    • Good jetting performance
    • Low shrinkage
    • Color: Black
    • Viscosity at 25°C (cPs): 8,200
    • Cure Schedule: 5 minutes at 80°C 15 minutes at 70°C
    • Pot Life at 25°C: 14 days
    • Storage Temperature: -20°C

FH8602W CONTACT US
Market: Electronic and Assembly Materials
Application: Low Temperature Cure Adhesives
Used For: Temperature-sensitive components
Technology: Epoxy
    Features and Benefits:
    • Good jetting performance
    • Low shrinkage
    • Color: White
    • Viscosity at 25°C (cPs): 8,200
    • Cure Schedule: 5 minutes at 80°C 15 minutes at 70°C
    • Pot Life at 25°C: 14 days
    • Storage Temperature: -20°C

FH8605 CONTACT US
Market: Electronic and Assembly Materials
Application: Low Temperature Cure Adhesives
Used For: Temperature-sensitive components
Technology: Epoxy
    Features and Benefits:
    • Good jetting and printing performance
    • Medium viscosity
    • Low shrinkage
    • Color: Black
    • Viscosity at 25°C (cPs): 22,000
    • Cure Schedule: 10 minutes at 80°C 20 minutes at 70°C
    • Pot Life at 25°C: 14 days
    • Storage Temperature: -20°C

FH8608 CONTACT US
Market: Electronic and Assembly Materials
Application: Low Temperature Cure Adhesives
Used For: Temperature-sensitive components
Technology: Epoxy
    Features and Benefits:
    • Can be used for die attach applications
    • Fast and low temperature cure
    • Low shrinkage
    • Color: Red
    • Viscosity at 25°C (cPs): 15,000
    • Cure Schedule: 2 minutes at 120°C 5 minutes at 100°C 25 minutes at 80°C
    • Pot Life at 25°C: 7 days
    • Storage Temperature: -20°C

FH8622 CONTACT US
Market: Electronic and Assembly Materials
Application: Low Temperature Cure Adhesives
Used For: Temperature-sensitive components
Technology: Epoxy
    Features and Benefits:
    • High toughness
    • Low shrinkage
    • Color: Black
    • Viscosity at 25°C (cPs): 9,700
    • Cure Schedule: 5 minutes at 80°C 15 minutes at 70°C
    • Pot Life at 25°C: 7 days
    • Storage Temperature: -20°C

FH8622W CONTACT US
Market: Electronic and Assembly Materials
Application: Low Temperature Cure Adhesives
Used For: Temperature-sensitive components
Technology: Epoxy
    Features and Benefits:
    • High toughness
    • Low shrinkage
    • Color: White
    • Viscosity at 25°C (cPs): 9,700
    • Cure Schedule: 5 minutes at 80°C 15 minutes at 70°C
    • Pot Life at 25°C: 7 days
    • Storage Temperature: -20°C

FH8623 CONTACT US
Market: Electronic and Assembly Materials
Application: Low Temperature Cure Adhesives
Used For: Temperature-sensitive components
Technology: Epoxy
    Features and Benefits:
    • Ultra fast curing
    • High toughness
    • Low Shrinkage
    • Color: Black
    • Viscosity at 25°C (cPs): 9,000
    • Cure Schedule: 3 minutes at 80°C 10 minutes at 70°C
    • Pot Life at 25°C: 3 days
    • Storage Temperature: -20°C

FH8623W CONTACT US
Market: Electronic and Assembly Materials
Application: Low Temperature Cure Adhesives
Used For: Temperature-sensitive components
Technology: Epoxy
    Features and Benefits:
    • Ultra fast curing
    • High toughness
    • Low Shrinkage
    • Color: White
    • Viscosity at 25°C (cPs): 9,000
    • Cure Schedule: 3 minutes at 80°C 10 minutes at 70°C
    • Pot Life at 25°C: 3 days
    • Storage Temperature: -20°C

FH8625 CONTACT US
Market: Electronic and Assembly Materials
Application: Low Temperature Cure Adhesives
Used For: Temperature-sensitive components
Technology: Epoxy
    Features and Benefits:
    • Improved LCP bonding strength
    • Low shrinkage
    • Color: White
    • Viscosity at 25°C (cPs): 12,000
    • Cure Schedule: 5 minutes at 80°C 15 minutes at 70°C
    • Pot Life at 25°C: 14 days
    • Storage Temperature: -20°C

Low Temperature Cure Adhesives

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