This site is optimized for Chrome, Firefox and Safari. Internet Explorer users, please disable compatibility mode for best viewing experience. ×

  • Focused On
  • Manufacturing Processes and Product Performance

Board Level Materials

H.B. Fuller’s board level materials offer customers excellent performance and high productivity. Moreover, these board level adhesives facilitate equipment savings and reduce technology investment adding to the customers bottom line. Being able to match materials for board assemblies provides consistency in manufacturing processes and product performance.

We offer a broad range of products, from multiple chemistries, to meet multiple board assembly applications. Urethane, acrylic, epoxy, and silicone chemistries are used in conformal coatings, adhesives (die attach, surface mount, thermally conductive) and potting/encapsulants.

Board Level Materials Products

Show Products For   
Contact Us for ordering information on all our application solutions.
Display 1 - 10 out of All Products
FE7012 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Heat sink attachment
Technology: One part, acrylic based
    Features and Benefits:
    • Thermally conductive material
    • Color: Gray
    • Cure Schedule: Activator
    • Hardness: 70 Shore D
    • Viscosity at Room Temperature: 80,000 cPs
    • Thermal  Conductivity: 1.2 W/m°C
    • Assembly Process: Pressure applied (< 3 minutes)

FE7012S CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Heat sink attachment
Technology: One part, acrylic based, self shimming
    Features and Benefits:
    • Thermally conductive material
    • Color: Gray
    • Cure Schedule: Activator
    • Hardness: 71 Shore D
    • Viscosity at Room Temperature: 80,100 cPs
    • Thermal Conductivity: 1.2 W/m°C
    • Assembly Process: Pressure applied (< 3 minutes)

FH6522 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Insulating
Technology: Epoxy
    Features and Benefits:
    • Thermally conductive
    • Low ionics
    • Outstanding adhesion
    • Color: Black
    • Cure Schedule: 60 minutes at 150˚C 2 hours at 125˚C
    • Hardness: 88 Shore D
    • Viscosity at Room Temperature: 200,000 cPs
    • Thermal  Conductivity: 1.24 w/mK
    • Assembly Process: No pressure required

Board Level Materials

Download the Board Level Materials At-a-glance PDF (english)

Request Board Level Materials Information

All fields required unless otherwise noted.

First Name:
Last Name:
Company Name:
  (optional)
Region:
City:
Country:
Market:  
Application:
What are you interested in? (Check all that apply)
More information about a product or solution
Purchasing products
Product advice
Other:  
Message::
How would you like to be contacted? (Check all that apply)
By E-mail:  
By Phone:  

Submit



Knowledge
Innovation
Performance