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  • Focused On
  • Manufacturing Processes and Product Performance

Board Level Materials

H.B. Fuller’s board level materials offer customers excellent performance and high productivity. Moreover, these board level adhesives facilitate equipment savings and reduce technology investment adding to the customers bottom line. Being able to match materials for board assemblies provides consistency in manufacturing processes and product performance.

We offer a broad range of products, from multiple chemistries, to meet multiple board assembly applications. Urethane, acrylic, epoxy, and silicone chemistries are used in conformal coatings, adhesives (die attach, surface mount, thermally conductive) and potting/encapsulants.

Board Level Materials Products

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FH8701 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Dispensable and stencil printing
Technology: Surface mounting adhesion
    Features and Benefits:
    • Color: Red
    • Cure Schedule: 90-120 seconds at 120°C 60-90 seconds at 150°C
    • Tg: 98°C
    • Hardness: 83 Shore D
    •  Viscosity: 250-300 Pa∙S
    • Tensile Strength: 15.2 Mpa

     


FH8702 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Dispensable and stencil printing
Technology: Surface mounting adhesion
    Features and Benefits:
    • Color: Red
    • Cure Schedule: 90-120 seconds at 120°C 60-90 seconds at 150°C
    • Tg: 98°C
    • Hardness: 83 Shore D
    • Viscosity: 400-600 Pa∙S
    • Tensile Strength: 15.2 Mpa

Board Level Materials

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