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  • Manufacturing Processes and Product Performance

Board Level Materials

H.B. Fuller’s board level materials offer customers excellent performance and high productivity. Moreover, these board level adhesives facilitate equipment savings and reduce technology investment adding to the customers bottom line. Being able to match materials for board assemblies provides consistency in manufacturing processes and product performance.

We offer a broad range of products, from multiple chemistries, to meet multiple board assembly applications. Urethane, acrylic, epoxy, and silicone chemistries are used in conformal coatings, adhesives (die attach, surface mount, thermally conductive) and potting/encapsulants.

Board Level Materials Products

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EH9695 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Hot melt encapsulation
Technology: Polyamide hot melt
    Features and Benefits:
    • Very good chemical resistance
    • High temperature stability
    • Color: Amber
    • Viscosity at Room Temperature: 3000 cPs @ 200°C
    • Continuous Use Temperature in Air:- 40 to 150°C
    • Pot Life < 8 hours at 200°C

Board Level Materials

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