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  • Focused On
  • Manufacturing Processes and Product Performance

Board Level Materials

H.B. Fuller’s board level materials offer customers excellent performance and high productivity. Moreover, these board level adhesives facilitate equipment savings and reduce technology investment adding to the customers bottom line. Being able to match materials for board assemblies provides consistency in manufacturing processes and product performance.

We offer a broad range of products, from multiple chemistries, to meet multiple board assembly applications. Urethane, acrylic, epoxy, and silicone chemistries are used in conformal coatings, adhesives (die attach, surface mount, thermally conductive) and potting/encapsulants.

Board Level Materials Products

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FH8801 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Chip bonding
Technology: One part, acrylate
    Features and Benefits:
    • Fast cure
    • High bond strength
    • High speed dispensing
    • Low outgassing
    • Color: Red
    • Viscosity at Room Temperature: 10,980 cps
    • Cure Schedule: 110°C for 90 seconds
    • Thixotropic Index: 2.61
    • Pot Life: 24 hours @ 25°C
    • Die Shear Strength: 20kgf (bare Cu sub) 6kgf (bare FR4 sub)

FH8800 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Bonding or potting adhesion
Technology: 1K Epoxy
    Features and Benefits:
    • Optically clear bonding or potting adhesive
    • Color: Optically Clear
    • Viscosity at 25°C (cPs): 3175
    • Cure Schedule: 10 minutes at 120°C 30 minutes at 100°C
    • Working Time at 25°C: 7 days

Board Level Materials

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