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  • Manufacturing Processes and Product Performance

Board Level Materials

H.B. Fuller’s board level materials offer customers excellent performance and high productivity. Moreover, these board level adhesives facilitate equipment savings and reduce technology investment adding to the customers bottom line. Being able to match materials for board assemblies provides consistency in manufacturing processes and product performance.

We offer a broad range of products, from multiple chemistries, to meet multiple board assembly applications. Urethane, acrylic, epoxy, and silicone chemistries are used in conformal coatings, adhesives (die attach, surface mount, thermally conductive) and potting/encapsulants.

Board Level Materials Products

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Display 1 - 10 out of All Products
FS3000 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Tough environments
Technology: One part, solvent-free, silicone RTV sealant
    Features and Benefits:
    • Good dielectric properties
    • Corrosion-free to metals
    • Color: Translucent
    • Viscosity at Room Temperature: 1600 cPs
    • Cure Schedule: Moisture Cure 48 hours @ 25°C
    • Moisture Cure: 48 hours @ 25°C
    • Tack Free Time: 15 minutes
    • Hardness: 20 Shore A, Tensile Strength: ASTM D0638 0.4 MPa

EA6103 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Tough environments
Technology: One part, solvent-free, acrylic based
    Features and Benefits:
    • Tough environment protection
    • Solvent based
    • UV curable
    • Color: Clear
    • Viscosity at Room Tempersture: 30 cPs
    • Tack Free Time: 10 minutes
    • Air dry
    • Hardness: 60 Shore A
    • Tensile Strength: ASTM D0638 6.0 Mpa

EA6106 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Tough environments
Technology: One part, solvent-free, acrylic based
    Features and Benefits:
    • Immediate handling
    • Excellent mechanical and chemical resistance
    • Color: Colorless to Light Green
    • Viscosity at Room Temperature: 175 cPs
    • Cure Schedule:< 10 seconds
    • UV cure @ 365nm
    • Hardness: 60 Shore A
    • Tensile Strength: ASTM D0638 9.1 MPa

FH1280AB CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Tough environments
Technology: Two part, solvent free, polyurethane based
    Features and Benefits:
    • Compatible and good adhesion with Parylene
    • Excellent point and sharp edge coverage
    • Excellent mechanical and chemical resistance
    • Color: Colorless to Light Yellow
    • Viscosity at Room Temperature: 300 cPs
    • Cure Schedule: 2 to 3 hours @ 80°C 7 days @ 25°C
    • Tack Free Time: 6 hours @ 25°C

Board Level Materials

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