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  • Manufacturing Processes and Product Performance

Board Level Materials

H.B. Fuller’s board level materials offer customers excellent performance and high productivity. Moreover, these board level adhesives facilitate equipment savings and reduce technology investment adding to the customers bottom line. Being able to match materials for board assemblies provides consistency in manufacturing processes and product performance.

We offer a broad range of products, from multiple chemistries, to meet multiple board assembly applications. Urethane, acrylic, epoxy, and silicone chemistries are used in conformal coatings, adhesives (die attach, surface mount, thermally conductive) and potting/encapsulants.

Board Level Materials Products

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Display 1 - 10 out of All Products
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FH8800 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Bonding or potting adhesion
Technology: 1K Epoxy
    Features and Benefits:
    • Optically clear bonding or potting adhesive
    • Color: Optically Clear
    • Viscosity at 25°C (cPs): 3175
    • Cure Schedule: 10 minutes at 120°C 30 minutes at 100°C
    • Working Time at 25°C: 7 days

FH6522 G CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Electric insulating
Technology: Epoxy
    Features and Benefits:
    • Thermally conductive
    • Low temp cure
    • Low ionics
    • Outstanding adhesion
    • Color: Black
    • Viscosity at Room Temperature: 200,000  cPs
    • Cure Schedule: 60 minutes at 150°C 2 hours at 125°C
    • Thermal Conductivity: 1.24 w/mK
    • Tg: 130°C
    • Coefficient of Thermal Expansion: 22 x 10-6

EH9695 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Hot melt encapsulation
Technology: Polyamide hot melt
    Features and Benefits:
    • Very good chemical resistance
    • High temperature stability
    • Color: Amber
    • Viscosity at Room Temperature: 3000 cPs @ 200°C
    • Continuous Use Temperature in Air:- 40 to 150°C
    • Pot Life < 8 hours at 200°C

FH6502 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Plastic adhesion
Technology: One part, high viscosity epoxy encapsulant
    Features and Benefits:
    • Good adhesion to plastics
    • Low temperature cure
    • Color: Black
    • Viscosity at Room Temperature: 62,000 cPs
    • Cure Schedule: 3 hours @ 100°C 5 minutes @ 150°C

FH6501 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Self-leveling
Technology: One part, low viscosity epoxy encapsulant
    Features and Benefits:
    • Self-leveling
    • Fast temperature cure
    • UL94V1 approved
    • Color: Black
    • Viscosity at Room Temperature: 7500 cPs
    • Cure Schedule: 3 hours at 100°C 5 minutes @ 150°C
    • Tack Free Time: 15 minutes @ 125°C
    • Hardness: 90 Shore D

FH3911A/B CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Clear applications
Technology: Two part, low viscosity polyurethane encapsulant
    Features and Benefits:
    • Water/optically clear
    • Low outgassing
    • Color: Clear
    • Viscosity at Room Temperature: 480 cPs
    • Cure Schedule: 2 hours at 65°C 5 days at 25°C
    • Tack Free Time: 10 minutes
    • Hardness: 92 Shore A
    • Tensile Modulus 35.2 Mpa

     


FH4008A/B CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Potting encapsulant
Technology: Electrically, insulating epoxy encapsulant
    Features and Benefits:
    • Excellent isolation resistance
    • Very low moisture absorption
    • Resistant to age hardening
    • Very high dielectric strength
    • High service temperature,
    • Color: Light Amber
    • Viscosity at Room Temperature: 4000 cPs
    • Cure Schedule: 5 hours at 70°C7 days at 25°C
    • Hardness: 85 Shore D

UR2187A/B CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Polycarbonate and metal adhesion
Technology: Two part, low viscosity polyurethane encapsulant
    Features and Benefits:
    • Bonds well to polycarbonate
    • PRC and metals
    • Color: Amber
    • Viscosity at Room Temperature: 900 cPs
    • Cure Schedule: 4 hours at 70°C 7 days at 25°C
    • Tack Free Time: 60 minutes
    • Hardness: 78 Shore A
    • Tensile Modulus 5.4 Mpa

FH1432A/B CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Superior dampening & vibration resistance
Technology: Soft epoxy encapsulant
    Features and Benefits:
    • Low modulus
    • Superior dampening and vibration resistance
    • Color: Black
    • Viscosity at Room Temperature: 900 cPs
    • Cure Schedule: 3 hours at 25°C 4 hours at 65°C
    • Tack Free Time: 24 hours
    • Hardness: 65 Shore 00
    • Tensile Modulus: 0.5 Mpa

FH6522 CONTACT US
Market: Electronic and Assembly Materials
Application: Board Level Materials
Used For: Insulating
Technology: Epoxy
    Features and Benefits:
    • Thermally conductive
    • Low ionics
    • Outstanding adhesion
    • Color: Black
    • Cure Schedule: 60 minutes at 150˚C 2 hours at 125˚C
    • Hardness: 88 Shore D
    • Viscosity at Room Temperature: 200,000 cPs
    • Thermal  Conductivity: 1.24 w/mK
    • Assembly Process: No pressure required

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Board Level Materials

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